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HELOXY™ Modifier 107 is a reactive diluent made from the diglycidyl ether of cyclohexane dimethanol, used to reduce viscosity in epoxy formulations while preserving cured-state properties. It also acts as a reactive intermediate for synthesizing cycloaliphatic-based resins. It improves air release, wetting, and pot life in applications like electrical potting, encapsulation, and impregnation. HELOXY™ Modifier 107 allows higher concentrations in blends (up to 40%) while maintaining performance, and is suitable for systems requiring excellent resistance to creep and deformation.
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HELOXY™ Modifier 116 is a low-viscosity, commercial-grade 2-ethylhexyl glycidyl ether monoepoxide used to reduce viscosity in epoxy formulations. It offers excellent substrate and filler wetting, low volatility, and efficient viscosity reduction. While HELOXY™ Modifier 116 reduces cured system functionality, its impact on room-temperature performance is minimal at modification levels below 10 phr.

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HELOXY™ Modifier 48 is a low-viscosity aliphatic triglycidyl ether designed to reduce the viscosity of epoxy resin systems while retaining reactivity. It enhances toughness and abrasion resistance, particularly in applications such as fast-setting adhesives, low-temperature curing systems, and hard, abrasion-resistant clear coatings. HELOXY™ Modifier 48 is compatible with all epoxy resins and supports higher cross-link density when cured with low-functionality agents like EPIKURE™ 3270 or 3274​.

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HELOXY™ Modifier 505 is a low-viscosity polyepoxide resin that enhances flexibility, impact resistance, and thermal shock resistance in epoxy formulations. It is compatible with conventional epoxy resins and is commonly used in stress-relieved concrete patching, thermal shock-resistant potting, high-impact tooling, and adhesives requiring high peel strength. HELOXY™ Modifier 505 provides excellent water resistance, superior electrical properties, and low odor, making it suitable for demanding industrial and structural applications​.

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HELOXY™ Modifier 61 is a commercial-grade butyl glycidyl ether used for efficient viscosity reduction in epoxy formulations. Its low viscosity and monoepoxide structure make it ideal for reducing processing difficulties in applications requiring substrate wetting and filler dispersion. HELOXY™ Modifier 61 minimizes compromise in cured-state properties, with a maximum recommended concentration of 20% to retain system performance, making it suitable for coatings, adhesives, and sealants​.

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