List of Walks
Industry:
Adhesives/Sealants/ElastomersDescription:
EPI-REZ™ Resin 3510-W-60 is a nonionic, waterborne dispersion of bisphenol A epoxy resin designed for solvent-free systems. It features excellent chemical and water resistance, high epoxy functionality, and is completely water-reducible, providing significant formulation flexibility. Ideal applications include industrial textile binders, adhesives, fiberglass-reinforced plastics, coatings, and modifiers for other waterborne resins. It forms clear, tacky films upon water evaporation, enabling strong adhesion and robust cured properties for demanding industrial environments.
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Industry:
Adhesives/Sealants/ElastomersDescription:
EPI-REZ™ Resin 3515-W-60 is a high-solids, solvent-free aqueous dispersion of bisphenol A epoxy resin with moderate viscosity and excellent mechanical stability. It is completely water-reducible, providing a versatile option for applications like industrial textile binders, adhesives, fiberglass-reinforced plastics, and coatings. This resin offers high epoxy functionality, water and chemical resistance, and compatibility with latex resins containing amine or carboxyl functionality. It forms clear, tacky films at room temperature and is suitable for use with various curing agents.
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Industry:
CoatingsDescription:
EPI-REZ™ Resin 3520-WY-55 is a 55% solids dispersion of EPON™ Resin 1001F in water and 2-propoxyethanol, designed for waterborne, two-package coatings. This resin delivers excellent gloss, chemical resistance, and stability, with compatibility across a wide range of curing agents. Applications include primers, enamels, industrial coatings, and decorative finishes, offering high performance with minimal solvent odor. It is ideal for formulating durable and chemically resistant aqueous systems.
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Industry:
Coatings Adhesives/Sealants/ElastomersDescription:
EPI-REZ™ Resin 3522-W-60 is a nonionic, aqueous dispersion of a solid epoxy resin, comparable to EPON™ Resin 1002F, with an epoxide equivalent weight of 550 - 650. It is supplied at a moderate viscosity and is mechanically stable.Designed for solvent-free applications, it is ideal for formulating film adhesives, chemical-resistant coatings, fiberglass-reinforced plastics, and industrial textile finishes. It is water-reducible and compatible with a variety of curing agents, including dicyandiamide and melamine resins. The resin requires heat for film coalescence, forming a smooth and durable coating.
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Industry:
Coatings Adhesives/Sealants/ElastomersDescription:
EPI-REZ™ Resin 3540-WY-55 is a 55% solids dispersion of EPON™ Resin 1007F in water and 2-propoxyethanol. Designed for industrial baking finishes, film adhesives, primers, and fiber finishes, it offers performance comparable to solvent-borne systems. It is compatible with aminoplast resins and waterborne amine curing agents, providing excellent adhesion to steel or aluminum, good flexibility, hardness, mar resistance, and low VOC formulations. It is used in clear bake coatings, pigmented bake coatings, and ambient-cure industrial primers.
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